Glass Wafer
High-quality glass wafers for CMOS, CCD, MEMS and optical semiconductor applications.
Product Overview
Our glass wafers serve as substrate materials for high-tech applications including CMOS image sensors, CCD devices, integrated circuits, MEMS and optical components. Available in multiple glass types including EAGLE, XG, D263T, BF33, JGS1 and SK1300, with various diameter and thickness options to meet different processing requirements.
Applications
CMOS Image SensorsCCD DevicesMEMSOptical ComponentsSemiconductor ProcessesIntegrated Circuits
Key Features
Multiple glass material options for different application requirements
Available in 150mm, 200mm and 300mm diameters
Excellent surface quality options (60/40, 40/20, 20/10)
Low TTV and warp specifications
Custom marking and edge treatment options
Ultra-smooth surface finish (Ra < 1nm available)
Available Materials
EAGLE XGD263TBF33JGS1SK1300
Technical Specifications
| Parameter | Specification |
|---|---|
| Diameters | 150mm (6"), 200mm (8"), 300mm (12") |
| Thickness Range | 0.2mm - 1.0mm (custom available) |
| Surface Quality | 60/40, 40/20, 20/10 (scratch/digit) |
| Surface Roughness | Ra < 1nm |
| TTV | < 5μm (material dependent) |
| Marking | Laser marking, ink marking available |
Customization Available
Customized specifications are available according to customer requirements. Contact us to discuss your specific needs.
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