Advanced Packaging Materials
Temporary bonding materials for wafer thinning, lithography, etching and 3D IC packaging.
Product Overview
Our advanced packaging materials include temporary bonding adhesives and solutions designed for wafer-level processing. These materials enable reliable temporary bonding during thin wafer processing operations including wafer thinning, lithography, etching and 3D integrated circuit packaging. The materials offer excellent flow properties, thermal stability, chemical resistance and controlled debonding characteristics.
Applications
Thin Wafer ProcessingWafer ThinningLithographyEtching3D Integrated Circuit PackagingMEMS Processing
Key Features
Excellent flow properties for uniform bonding layer
High thermal stability for demanding process temperatures
Chemical resistance for process compatibility
Sufficient bonding strength with controlled debonding
Easy separation and cleaning after processing
Compatible with standard semiconductor equipment
Technical Specifications
| Parameter | Specification |
|---|---|
| Application | Temporary bonding / debonding |
| Process Compatibility | Thinning, lithography, etching, 3D IC |
| Thermal Stability | High temperature process compatible |
| Bonding Strength | Sufficient for processing, easy debond |
| Separation Method | Thermal slide-off / laser debonding |
Customization Available
Customized specifications are available according to customer requirements. Contact us to discuss your specific needs.
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